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ntc thermistors t (?c) 0 C20 C40 20 40 60 80 100 120 140 1000 r t /r 25 100 10 1 0.1 0.01 0.001 5000 6000 4000 3000 2000 b=1000 r ( ? ) t (?c) 2.4 1 2.9 3.4 3.9 4.4 125 85 50 25 0 C20 C40 10000000 1000000 100000 10000 10 1000 100 & 3 5 + & 3 < b 2 5 / 5 0 = 4 2 5 0 & 3 5 + & 3 < b 2 5 / 5 0 = 4 2 5 0 & 3 5 + & ( < " b 2 5 / 8 5 = 3 4 3 5 & 3 5 + & ( < " b 2 5 / 8 5 = 3 4 3 5 & 3 5 + & 1 < b 2 5 / 5 0 = 4 0 5 0 & 3 5 + & 7 < b 2 5 / 5 0 = 4 7 0 0 & 3 5 + & 7 < b 2 5 / 5 0 = 4 7 0 0 & 3 5 + & " < b 2 5 / 5 0 = 2 8 0 0 & 3 5 + & " < b 2 5 / 5 0 = 2 8 0 0 & 3 5 + & 5 < b 2 5 / 50 = 4 5 0 0 & 3 5 + & 5 < b 2 5 / 50 = 45 0 0 t 1 ( l 10 C3 k C1 ) & 3 5 + & 1 < b 2 5 / 5 0 = 4 0 5 0 the ntc thermistors this is a negative temperature coef? cient resistor whose resistance changes as ambient temperature changes. therm- istor comprises 2 or 4 kinds of metal oxides of iron, nickel, cobalt, manganese and copper, be ing shaped and sintered at high temperature (1200 to 1500 c) recommended applications for temperature measurement or temperature detection : thermometer, temperature controller for temperature compensation : transistor circuit, measuring instruments features temperature coef? cient of resistance is negative and extremely large various kinds of types especially smaller ones are available. resistance values are available from 22 to 470 k fig. 1 fi g. 2 physical characteristics of ntc thermistors thermistor is a resistor sensitive to temperature utilizing the large temperature-coefficient of metal oxide semi- conductor. and its temperature dependency of resistance value is indicated by the following equation: r=r 0 exp b .................................... (1) t 0 : standard temperature 298.15 k(25 c) r 0 : resistance at t 0 k b: thermistor constant (k) so called temperature coefficient ( a ) is generally indicated as follows: a = .................................................................... (2) but a is not adequate for use as a constant, because a change by temperature is considerably large, so b value is used as a coef? cient of thermistor. 1 t 1 t 0 ( )[ ] b t 2 major characteristics of ntc thermistors the relation between resistance and temperature of a thermistor is linear as shown in fig. 2, in which resistance is shown in vertical direction in a logarithmic scale and reciprocal of absolute temperature in horizontal direction. bias degrees in these straight lines are determined according to the b value expressed by the following equation. b = .................................................. (3) r 1 : resistance at t 1 k r 2 : resistance at t 2 k when calculated from this equation, b value is a variable in a strict sense, and the resistance is expressed by the following equation: r = at C c exp d/t ........................................................ (4) in (4), c is a small positive or negative constant and quite negligible except use in precision temperature-measuring device, thereby the b value is, in practical usage, to be considered as a constant. in fig. 1, the relation between the resistance ratio r t /r 25 (r 25 : resistance at 25 c, r t : resistance at t c) and b value is shown with t c, in the horizontal direction. 1 t 1 1 t 2 k nr 1 C k nr 2 sep. 2010 00 2
design and speci cations are each subject to change without notice. ask factory for the current technical speci cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. multilayer ntc thermistors & 1 3 2 5+&(+" 3 4 5 6 78 9 10 11 12 $pnnpo$pef ert j product code type code ntc thermistors chip type (smd) multilayer type 4j[f$pef 0201 0402 0603 z 0 1 1bdlbhjoh 4uzmf$pef e v 1% 2% 3% 5% f g h j 3ftjtubodf5pmfsbodf $pef /pnjobm3ftjtubodf 3 ?
the ?rst two digits are signi?cant ?gures of resistance and the third one denotes the number of zeros following them. (example) #7bmvf$mbtt$pef 2701 to 2800 3301 to 3400 3801 to 3900 4001 to 4100 4201 to 4300 4301 to 4400 4401 to 4500 4601 to 4700 a g m p r s t v 4qfdjbm 4qfdjgjdbujpo 0201, 0402 pressed carrier taping punched carrier taping (pitch : 2 mm) 0603 punched carrier taping (pitch : 4 mm) narrow tolerance type standard type 5 4 3 2 1 multilayer ntc thermistors series: ertj recommended applications mobile phone temperature compensation for crystal oscillator temperature compensation for semiconductor devices personal computer temperature detection for cpu and memory device temperature compensation for ink-viscosity (inkjet printer) battery pack temperature detection of battery cells liquid crystal display temperature compensation of display contrast temperature compensation of display backlighting (ccfl) features surface mount device (0201, 0402, 0603) highly reliable multilayer / monolithic structure wide temperature operating range (C40 to 125 c) environmentally-friendly lead-free rohs compliant explanation of part numbers construction no name a semiconductive ceramics b internal electrode c terminal electrode substrate electrode d intermediate electrode e external electrode dec. 2013 01 3
design and speci cations are each subject to change without notice. ask factory for the current technical speci cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. multilayer ntc thermistors l t w l 1 l 2 e c d a w 2 w 1 b 100 min. vacant position top cover tape 400 min. 160 min. vacant position t p 1 p 2 p 0 k 0 fd 0 a b f w e tape running direction chip component feeding hole chip pocket t 2 chip component feeding hole chip pocket fd 0 p 1 p 2 p 0 tape running direction ef w b a t 1 t 1 p 1 p 2 p 0 tape running direction t 2 chip component feeding hole chip pocket fd 0 a b f w e dimensions in mm (not to scale) size code (eia) lwtl 1 , l 2 z(0201) 0.600.03 0.300.03 0.300.03 0.150.05 0(0402) 1.00.1 0.500.05 0.500.05 0.250.15 1(0603) 1.600.15 0.80.1 0.80.1 0.30.2 packaging methods standard packing quantities reel for taping symbol f a f b cdew 1 w 2 dim. (mm) 180 C3 60.0 +1. 0 13.0 0.5 21.0 0.8 2.0 0.5 9.0 +1. 0 11.4 1.0 0 taped end leader part and taped end leader part (unit : mm) pitch 2 mm (pressed carrier taping) : size 0201 pitch 2 mm (punched carrier taping) : size 0402 pitch 4 mm (punched carrier taping) : size 0603 symbol abwfep 1 p 2 p 0 f d 0 t 1 t 2 dim. (mm) 1.0 0.1 1.8 0.1 8.0 0.2 3.50 0.05 1.75 0.10 4.0 0.1 2.00 0.05 4.0 0.1 1.5 +0.1 0 1.1 max. 1.4 max. symbol abwfep 1 p 2 p 0 f d 0 t 1 t 2 dim. (mm) 0.62 0.05 1.12 0.05 8.0 0.2 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.0 0.1 1.5 +0.1 0 0.7 max. 1.0 max. symbol abwfep 1 p 2 p 0 f d 0 tk 0 dim. (mm) 0.36 0.03 0.66 0.03 8.0 0.2 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.0 0.1 1.5 +0.1 0 0.55 max. 0.36 0.03 (unit : mm) minimum quantity / packing unit 0 0 size code thickness (mm) kind of taping pitch (mm) quantity (pcs./reel) z(0201) 0.3 pressed carrier taping 2 15,000 0(0402) 0.5 punched carrier taping 2 10,000 1(0603) 0.8 4 4,000 part number (size) minimum quantity / packing unit packing quantity in carton carton lwh (mm) ertjz (0201) 15,000 300,000 250 200200 ertj0 (0402) 10,000 200,000 250 200200 ertj1 (0603) 4,000 80,000 250 200200 part no., quantity and country of origin are designated o n outer packages in english. dec. 2013 01 4
design and speci cations are each subject to change without notice. ask factory for the current technical speci cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. multilayer ntc thermistors ratings size code (eia) z(0201) 0(0402) 1(0603) operating temperature range C40 to 125 c rated maximum power dissipation ? 1 33 mw 66 mw 100 mw dissipation factor ? 2 approximately 1 mw/c approximately 2 mw/c approximately 3 mw/c ? 1 rated maximum power dissipation : the maximum power that can be continuously applied at the rated ambient temperature. the maximum power dissipation under ambient temperature 25 c or less is the same with the rated maximum power dissipation, a nd maximum power dissipation beyond 25 c depends on the decreased power dissipation curve. please see operating power for details paging 371. ? 2 dissipation factor : the constant amount power required to raise the temperature of the thermistor 1 c through self heat gen eration under stable temperatures. dissipation factor is the reference value when mounted on a glass epoxy board (1.6 mmt). resistance ratios to r 25 at each temperature/reference values (for obtaining resistance at each temperature by using r 25 shown in part number) r 25 =resistance at 25.00.1 c r 50 =resistance at 50.00.1 c r 85 =resistance at 85.00.1 c b 25/50 = k n (r 25 /r 50 ) 1/298.15C1/323.15 b 25/85 = k n (r 25 /r 85 ) 1/298.15C1/358.15 ? 1 other than ertj0et104 in b 25/50 =4500k. ? 2 ertj0et104 only. ertja ? ertjg ? ertjm ? ertjp ? ertjr ? ertj0es ? ertj1vs ? ertjt ? ertj0et104 ertjv ? b 25/50 2750 k 2800 k (3375 k) 3900 k 4050 k 4250k 4330k (4330k) 4500k 4500k 4700k b 25/85 (2700 k) (2750 k) 3435 k (3970 k) (4100 k) (4300k) (4390k) 4390k (4450k) (4580k) (4750k) t(c) ? 1 ? 2 -40 13.05 13.28 20.52 32.11 33.10 43.10 45.67 45.53 63.30 47.07 59.76 -35 10.21 10.40 15.48 23.29 24.03 30.45 32.08 31.99 42.92 33.31 41.10 -30 8.061 8.214 11.79 17.08 17.63 21.76 22.80 22.74 29.50 23.80 28.61 -25 6.427 6.547 9.069 12.65 13.06 15.73 16.39 16.35 20.53 17.16 20.14 -20 5.168 5.261 7.037 9.465 9.761 11.48 11.91 11.89 14.46 12.49 14.33 -15 4.191 4.261 5.507 7.147 7.362 8.466 8.743 8.727 10.30 9.159 10.31 -10 3.424 3.476 4.344 5.444 5.599 6.300 6.479 6.469 7.407 6.772 7.482 -5 2.819 2.856 3.453 4.181 4.291 4.730 4.845 4.839 5.388 5.046 5.481 0 2.336 2.362 2.764 3.237 3.312 3.582 3.654 3.650 3.966 3.789 4.050 5 1.948 1.966 2.227 2.524 2.574 2.734 2.778 2.776 2.953 2.864 3.015 10 1.635 1.646 1.806 1.981 2.013 2.102 2.128 2.126 2.221 2.179 2.262 15 1.380 1.386 1.474 1.567 1.584 1.629 1.642 1.641 1.687 1.669 1.710 20 1.171 1.174 1.211 1.247 1.255 1.272 1.277 1.276 1.293 1.287 1.303 25 1 1 1 1 1 1 1 1 1 1 1 30 0.8585 0.8565 0.8309 0.8072 0.8016 0.7921 0.7888 0.7890 0.7799 0.7823 0.7734 35 0.7407 0.7372 0.6941 0.6556 0.6461 0.6315 0.6263 0.6266 0.6131 0.6158 0.6023 40 0.6422 0.6376 0.5828 0.5356 0.5235 0.5067 0.5004 0.5007 0.4856 0.4876 0.4721 45 0.5595 0.5541 0.4916 0.4401 0.4266 0.4090 0.4022 0.4025 0.3874 0.3884 0.3723 50 0.4899 0.4836 0.4165 0.3635 0.3496 0.3319 0.3251 0.3254 0.3111 0.3111 0.2954 55 0.4309 0.4238 0.3543 0.3018 0.2881 0.2709 0.2642 0.2645 0.2513 0.2504 0.2356 60 0.3806 0.3730 0.3027 0.2518 0.2386 0.2222 0.2158 0.2161 0.2042 0.2026 0.1889 65 0.3376 0.3295 0.2595 0.2111 0.1985 0.1832 0.1772 0.1774 0.1670 0.1648 0.1523 70 0.3008 0.2922 0.2233 0.1777 0.1659 0.1518 0.1463 0.1465 0.1377 0.1348 0.1236 75 0.2691 0.2600 0.1929 0.1504 0.1393 0.1264 0.1213 0.1215 0.1144 0.1108 0.1009 80 0.2417 0.2322 0.1672 0.1278 0.1174 0.1057 0.1011 0.1013 0.09560 0.09162 0.08284 85 0.2180 0.2081 0.1451 0.1090 0.09937 0.08873 0.08469 0.08486 0.08033 0.07609 0.06834 90 0.1974 0.1871 0.1261 0.09310 0.08442 0.07468 0.07122 0.07138 0.06782 0.06345 0.05662 95 0.1793 0.1688 0.1097 0.07980 0.07200 0.06307 0.06014 0.06028 0.05753 0.05314 0.04712 100 0.1636 0.1528 0.09563 0.06871 0.06166 0.05353 0.05099 0.05112 0.04903 0.04472 0.03939 105 0.1498 0.1387 0.08357 0.05947 0.05306 0.04568 0.04340 0.04351 0.04198 0.03784 0.03308 110 0.1377 0.1263 0.07317 0.05170 0.04587 0.03918 0.03708 0.03718 0.03609 0.03218 0.02791 115 0.1270 0.1153 0.06421 0.04512 0.03979 0.03374 0.03179 0.03188 0.03117 0.02748 0.02364 120 0.1175 0.1056 0.05650 0.03951 0.03460 0.02916 0.02734 0.02742 0.02702 0.02352 0.02009 125 0.1091 0.09695 0.04986 0.03470 0.03013 0.02527 0.02359 0.02367 0.02351 0.02017 0.01712 dec. 2013 01 5
design and speci cations are each subject to change without notice. ask factory for the current technical speci cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. multilayer ntc thermistors 1.0 test sample 0.5r 0.3/size:0201 0.5/size:0402 board 1.0 test sample unit : mm 20 452 452 bending distance unit : mm r340 specifi cation and test method item specifi cation test method rated zero-power resistance (r 25 ) within the speci? ed tolerance. the value of the d.c. resistance shall be measured at the rated ambient temperature of 25.0 0.1 c under the power less than 0.1mw which is negligible self heat generation. b value within the speci? ed tolerance. ? individual speci? cation shall specify b 25/50 or b 25/85 . the zero-power resistances; r 1 and r 2 , shall be measured respectively at t 1 (c) and t 2 (c). the b value is calculated by the following equation. b t 1 /t 2 = k n (r 1 )C k n (r 2 ) 1/(t 1 +273.15)C1/(t 2 +273.15) t 1 t 2 b 25/50 25.0 0.1 c 50.0 0.1 c b 25/85 25.0 0.1 c 85.0 0.1 c adhesion the terminal electrode shall be free from peeling or signs of peeling. applied force : size 0201 : 2 n size 0402, 0603 : 5 n duration : 10 s size : 0201, 0402 size : 0603 bending strength there shall be no cracks and other mechanical damage. r 25 change : within 5 % bending distance : 1 mm bending speed : 1 mm/s resistance to soldering heat there shall be no cracks and other mechanical damage. nallow tol. type standard type r 25 change : within 2 % within 3 % b value change : within 1 % within 2 % soldering bath method solder temperature : 270 5 c dipping period : 3.0 0.5 s preheat condition : step temp (c) period (s) 1 80 to 100 120 to 180 2 150 to 200 120 to 180 solderability more than 75 % of the soldered area of both terminal electrodes shall be covered with fresh solder. soldering bath method solder temperature : 230 5 c dipping period : 4 1 s solder : h63a (jisCzC3282) dec. 2013 01 6
design and speci cations are each subject to change without notice. ask factory for the current technical speci cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. multilayer ntc thermistors part number list of narrow tolerance type (resistance tolerance : 2 %, 1 %) 0201(eia) nominal resistance at 25 c resistance tolerance b value class code g p s v nominal b value ? () reference value b 25/50 b 25/85 (3375 k) 3435 k1 % 4050 k1 % (4100 k) 4330 k1 % (4390 k) 4700 k1 % (4750 k) 10 k 1 %(f) or 2 %(g) ertj0eg103a 47 k ertj0ep473 100 k ertj0es104 ertj0ev104 : resistance tolerance code avoid ? ow soldering. 0603(eia) nominal resistance at 25 c resistance tolerance b value class code g s nominal b value ? () reference value b 25/50 b 25/85 (3375 k) 3435 k1 % (4330 k) 4390 k1 % 10 k 1 %(f) or 2 %(g) ertj1vg103a 100 k ertj1vs104a : resistance tolerance code avoid ? ow soldering. specifi cation and test method item specifi cation test method temperature cycling nallow tol. type standard type r 25 change : within 2 % within 3 % b value change : within 1 % within 2 % conditions of one cycle step 1 : C40 c, 303 min step 2 : room temp., 3 min max. step 3 : 125 c, 303 min. step 4 : room temp., 3 min max. number of cycles: 100 cycles moisture resistance nallow tol. type standard type r 25 change : within 2 % within 3 % b value change : within 1 % within 2 % temperature : 85 2 c relative humidity : 85 5 % test period : 1000 +48/0 h damp heat load nallow tol. type standard type r 25 change : within 2 % within 3 % b value change : within 1 % within 2 % temperature : 85 2 c relative humidity : 85 5 % applied power : 10 mw test period : 500 +24/0 h cold resistance nallow tol. type standard type r 25 change : within 2 % within 3 % b value change : within 1 % within 2 % temperature : C40 3 c test period : 1000 +48/0 h dry heat resistance nallow tol. type standard type r 25 change : within 2 % within 3 % b value change : within 1 % within 2 % temperature : 125 3 c test period : 1000 +48/0 h nominal resistance at 25 c resistance tolerance b value class code g p v nominal b value ? () reference value b 25/50 b 25/85 (3375 k) 3435 k1 % 4050 k1 % (4100 k) 4700 k1 % (4750 k) 10 k 1 %(f) or 2 %(g) ertjzeg103a 47 k ertjzep473 100 k ertjzev104 : resistance tolerance code avoid ? ow soldering. 0402(eia) dec. 2013 01 7
design and speci cations are each subject to change without notice. ask factory for the current technical speci cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. multilayer ntc thermistors part number list of standard type (resistance tolerance : 5 %, 3 %) 0201(eia) nominal resistance at 25 c resistance tolerance b value class code g p t v nominal b value ? () reference value b 25/50 b 25/85 (3375 k) 3435 k2 % 4050 k3 % (4100 k) 4500 k2 % (4450 k) 4700 k2 % (4750 k) 2.0 k 3 %(h) or 5 %(j) ertjzet202 3.0 k ertjzet302 4.7 k ertjzet472 10 k ertjzeg103a 47 k ertjzep473 100 k ertjzev104 : resistance tolerance code avoid ? ow soldering. 0402(eia) : resistance tolerance code avoid ? ow soldering. nominal resistance at 25 c resistance tolerance b value class code a nominal b value ? () reference value b 25/50 b 25/85 2750 k3 % (2700 k) 2800 k3 % (2750 k) 22 3 %(h) or 5 %(j) ertj0ea220 33 ertj0ea330 40 ertj0ea400 47 ertj0ea470 68 ertj0ea680 100 ertj0ea101 150 ertj0ea151 nominal resistance at 25 c resistance tolerance b value class code s t v nominal b value ? () reference value b 25/50 b 25/85 4330 k2 % (4390 k) 4500 k2 % (4450 k, 4580 k) 4700 k2 % (4750 k) 1.0 k 3 %(h) or 5 %(j) ertj0et102 1.5 k ertj0et152 2.0 k ertj0et202 2.2 k ertj0et222 3.0 k ertj0et302 3.3 k ertj0et332 4.7 k ertj0et472 47 k ertj0ev473 68 k ertj0ev683 100 k ertj0es104 ertj0et104 ertj0ev104 150 k ertj0et154 ertj0ev154 220 k ertj0ev224 330 k ertj0ev334 470 k ertj0ev474 nominal resistance at 25 c resistance tolerance b value class code g m p r nominal b value ? () reference value b 25/50 b 25/85 (3375 k) 3435 k1 % 3900 k2 % (3970 k) 4050 k2 % (4100 k) 4250 k2 % (4300 k) 3.3 k 3 %(h) or 5 %(j) ertj0er332 4.7 k ertj0er472 6.8 k ertj0er682 10 k ertj0eg103 a ertj0em103 ertj0er103 15 k ertj0er153 22 k ertj0er223 33 k ertj0ep333 ertj0er333 47 k ertj0ep473 100 k ertj0ep104 dec. 2013 01 8
design and speci cations are each subject to change without notice. ask factory for the current technical speci cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. multilayer ntc thermistors 0603(eia) nominal resistance at 25 c resistance tolerance b value class code a g p nominal b value ? () reference value b 25/50 b 25/85 2750 k3 % (2700 k) 2800 k3 % (2750 k) (3375 k) 3435 k1 % 4050 k3 % (4100 k) 22 3 %(h) or 5 %(j) ertj1va220 33 ertj1va330 40 ertj1va400 47 ertj1va470 68 ertj1va680 100 ertj1va101 10 k ertj1vg103a 47 k ertj1vp473 nominal resistance at 25 c resistance tolerance b value class code r s t v nominal b value ? () reference value b 25/50 b 25/85 4250 k2 % (4300 k) (4330 k) 4390 k1% 4500 k2 % (4450 k) 4700 k2 % (4750 k) 1.0 k 3 %(h) or 5 %(j) ertj1vt102 1.5 k ertj1vt152 2.0 k ertj1vt202 2.2 k ertj1vt222 3.0 k ertj1vt302 3.3 k ertj1vr332 ertj1vt332 4.7 k ertj1vr472 ertj1vt472 6.8 k ertj1vr682 10 k ertj1vr103 15 k ertj1vr153 22 k ertj1vr223 33 k ertj1vr333 47 k ertj1vr473 ertj1vv473 68 k ertj1vr683 ertj1vv683 100 k ertj1vs104a ertj1vv104 150 k ertj1vv154 : resistance tolerance code avoid ? ow soldering. dec. 2013 01 9
design and speci cations are each subject to change without notice. ask factory for the current technical speci cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. multilayer ntc thermistors rth ntc ntc [for low temp.] [for high temp.] rth r r r r c c cc xtal vcc output 0tdgsfrefwjbujpoege5 qqn
with compensation without compensation -20 8 0 -8 25 75 vcc rth r rl ad converter cpu interface gmr head ntc vcc rth r r r lcd ntc typical application temperature detection writing current control of hdd temperature compensation (pseudo-linearization) contrast level control of lcd temperature compensation (rf circuit) temperature compensation of tcxo dec. 2013 01 10
multilayer ntc thermistors 25 100 75 ambient temperature (c) maximum power dissipation / rated maximum power dissipation (%) 125 50 multilayer chip ntc thermistors series: ertj operating conditions and circuit design 1. circuit design 1.1 operating temperature and storage temperature the specified operating temperature range found in the speci? cations is the absolute maximum and minimum temperature rating. every thermistor shall be operated within the specified operating temperature range. the thermistors mounted on pcb shall be stored without operating within the specified storage temperature range in the speci? cations. 1.2 operating power thermistors shall not be operated in excess of the maximum power dissipation. if the thermistors are operated beyond the speci? ed maximum power dissipation, it may cause burnout and/or damage due to thermal run away. for temperature detection applications, the accuracy may be greatly influenced by self-heat generation and the heat dissipation of the thermistor, even if the thermistor is operated under the specified maximum power dissipation. please check the safety and reliability of your circuit. safety precautions multilayer ntc thermistors (hereafter referred to as therm istors) should be used for general purpose applications found in consumer electronics (audio/visual, home , of? ce, information & communication) equipment. when subjected to severe electrical, environmental, and/or mechanical stress beyond the speci? cations, as noted in the ratings and speci? ed conditions section, the thermist or may fail in a short circuit mode or in an open-circuit mode. this case results in a burn-out, smoke or ? aming. for products which require high safety levels, please carefully consider how a single malfunction can affect your product. in order to ensure the safety in the case of a si ngle malfunction, please design products with fail-safe, such as setting up protecting circuits, etc. for the following applications and conditions, please contact us for additional not found in this document. when your application may have dif? culty complying wi th the safety or handling precautions speci? ed below. for any applications where a malfunction with this produc t may directly or indirectly cause hazardous conditions which could result in death or injury; 1 aircraft and aerospace equipment (arti? cial satellite, rocket, etc.) 2 submarine equipment (submarine repeating equipment, etc.) 3 transportation equipment (motor vehicles, airplanes, trains, ship, traf? c signal controllers, etc.) 4 power generation control equipment (atomic power, hydroe lectric power, thermal power plant control system, etc.) 5 medical equipment (life-support equipment, pacemakers, dialysis controllers, etc.) 6 information processing equipment (large scale computer systems, etc.) 7 electric heating appliances, combustion devices (gas fan heaters, oil fan heaters, etc.) 8 rotary motion equipment 9 security systems j and any similar types of equipment handling precautions [maximum power dissipation] the maximum power that can be continuously applied under static air at a certain ambient temperature. the maximum power dissipation under an ambient temperature of 25 c or less is the same with the rated maximum power dissipation, and maximum power dissipation beyond 25 c depends on the decreased power dissipation curve below. [dissipation factor] the constant amount power required to raise the temperature of the thermistor 1 c through self heat generation under stable temperatures. dissipation factor (mw/c) = power consumption of thermistor / temperature rise of element decreased power dissipation curve sep. 2010 00 11
multilayer ntc thermistors ab c land smd solder resist (a) excessive amount (b) proper amount (c) insuf?cient amount solder resist land portion to be excessively soldered a lead wire of retro-?tted component soldering iron solder (ground solder) chassis electrode pattern solder resist solder resist solder resist the lead wire of a component with lead wires 1.3 environmental restrictions the thermistors shall not be operated and/or stored under the following conditions. (1) environmental conditions (a) under direct exposure to water or salt water (b) under conditions where water can condense and/or dew can form (c) under conditions containing corrosive gases such as hydrogen sulfide, sulfurous acid, chlorine and ammonia (2) mechanical conditions under severe conditions of vibration or impact beyond the specified conditions found in the speci? cations. 1.4 measurement of resistance the resistance of the thermistors varies dependent on ambient temperatures and self-heating. note the following points when measuring resistance values of the thermistors during inspection or when considering them for circuits. 1 measurement temp : 250.1 c measurement in liquid (silicon oil, etc.) is recommended for a stable measurement temperature. 2 power : 0.10 mw max. 4 terminal measurement with a constant-current power supply is recommended. 2. design of printed circuit board 2.1 selection of printed circuit boards when the thermistors are mounted and soldered on an alumina substrate, the substrate in? uences the thermistors reliability against temperature cycles and heat shock due to the difference in the thermal expansion coefficient between them. confirm that the actual board used does not deteriorate the characteristics of the thermistors. 2.2 design of land pattern (1) recommended land dimensions are shown below. use the proper amount of solder in order to prevent cracking. using too much solder places excessive stress on the thermistors. unit (mm) size code (eia) component dimensions abc lwt z(0201) 0.6 0.3 0.3 0.2 to 0.3 0.25 to 0.30 0.2 to 0.3 0(0402) 1.0 0.5 0.5 0.4 to 0.5 0.4 to 0.5 0.4 to 0.5 1(0603) 1.6 0.8 0.8 0.8 to 1.0 0.6 to 0.8 0.6 to 0.8 recommended land dimensions (2) the size of lands shall be designed to have equal spacing between the right and left sides. if the amount of solder on the right land is different from that on the left land, the component may be cracked by stress since the side with a larger amount of solder solidi? es later during cooling. recommended amount of solder 2.3 utilization of solder resist (1) solder resist shall be utilized to equalize the amounts of solder on both sides. (2) solder resist shall be used to divide the pattern for the following cases; components are arranged closely. the thermistor is mounted near a component with lead wires. the thermistor is placed near a chassis. see the table below. prohibited applications and recommended applications item prohibited applications improved applications by pattern division mixed mounting with a component with lead wires arrangement near chassis retro-? tting of component with lead wires lateral arrangement 2.4 component layout the thermistors/components shall be placed on the pc board such that both electrodes are subjected to uniform stresses, or to position the component electrodes at right angles to the grid glove or bending line. this should be done to avoid cracking the thermistors from bending the pc board after or during placing/mounting on the pc board. placement of the thermistors near heating elements also requires that great care be taken in order to avoid stresses from rapid heating and cooling. sep. 2010 00 12
multilayer ntc thermistors a b c e d slit magnitude of stress a>b=c>d>e perforation supporting pin supporting pin crack separation of solder crack (1) to minimize mechanical stress caused by the warp or bending of a pc board, please follow the recommended thermistors layout below. (2) the following layout is for your reference since mechanical stress near the dividing/breaking position of a pc board varies depending on the mounting position of the thermistors. (3) the magnitude of mechanical stress applied to the thermistors when the circuit board is divided is in the order of push back < slit < v-groove < perforation. also take into account the layout of the thermistors and the dividing/breaking method. (4) when the thermistors are placed near heating elements such as heater, etc., cracks from thermal stresses may be caused by the following: soldering the thermistors directly heating elements. mounting the thermistors on the same land that another thermistor is mounted on. for the above-mentioned mounting and/or placement, please contact us in advance, 2.5 mounting density and spaces if components are arranged in too narrow a space, the components can be affected by solder bridges and solder balls. the space between components should be carefully determined . precautions for assembly 1. storage (1) the thermistors shall be stored between 5 - 40 c and 20 - 70 % rh, not under severe conditions of high temperature and humidity. (2) if stored in a place that is humid, dusty, or contains corrosive gasses (hydrogen sulfide, sulfurous acid, hydrogen chloride and ammonia etc.), the solderability of terminal electrodes may deteriorate. in addition, storage in a place subjected to heating and/or exposure to direct sunlight will cause deformed tapes and reels, and component sticking to tapes, both of which can result in mounting problems (3) do not store components longer than 6 months. check the solderability of products that have been stored for more than 6 months before use 2. chip mounting consideration (1) when mounting the thermistors/components on a pc board, the thermistor bodies shall be free from excessive impact loads such as mechanical impact or stress due to the positioning, pushing force and displacement of vacuum nozzles during mounting. (2) maintenance and inspection of the chip mounter must be performed regularly. (3) if the bottom dead center of the vacuum nozzle is too low, the thermistor will crack from excessive force during mounting. the following precautions and recommendations are for your reference in use. (a) set and adjust the bottom dead center of the vacuum nozzles to the upper surface of the pc board after correcting the warp of the pc board. (b) set the pushing force of the vacuum nozzle during mounting to 1 to 3 n in static load. (c) for double surface mounting, apply a supporting pin on the rear surface of the pc board to suppress the bending of the pc board in order to minimize the impact of the vacuum nozzles. typical examples are shown in the table below. item prohibited mounting recommended mounting single surface mouting the supporting pin does not necessarily have to be positioned beneath the thermistor. double surface mounting (d) adjust the vacuum nozzles so that their bottom dead center during mounting is not too low. (4) the closing dimensions of the positioning chucks shall be controlled. maintenance and replacement of positioning chucks shall be performed regularly to prevent chipping or cracking of the thermistors caused by mechanical impact during positioning due to worn positioning chucks. (5) maximum stroke of the nozzle shall be adjusted so that the maximum bending of pc board does not exceed 0.5 mm at 90 mm span. the pc board shall be supported by an adequate number of supporting pins. 3. selection of soldering flux soldering ? ux may seriously affect the performance of the thermistors. the following shall be con? rmed before use. (1) the soldering flux should have a halogen based content of 0.1 wt% (converted to chlorine) or below. do not use soldering ? ux with strong acid. (2) when applying water-soluble soldering flux, wash the thermistors sufficiently because the soldering flux residue on the surface of pc boards may deteriorate the insulation resistance on the thermistors surface. prohibited layout recommended layout layout the thermistors sideways against the stressing direction sep. 2010 00 13
multilayer ntc thermistors time gradual cooling 5 heating3 peak4 temp. rise 65 2 preheating 1 60 sec max. 60 to 120 sec temperature (c) 260 220 180 140 6t preheating gradual cooling 60 to 120 sec 3 sec max. 4. soldering 4.1 refl ow soldering the reflow soldering temperature conditions are each temperature curves of preheating, temp. rise, heating, peak and gradual cooling. large temperature difference caused by rapid heat application to the thermistors may lead to excessive thermal stresses, contributing to the thermal cracks. the preheating temperature requires controlling with great care so that tombstone phenomenon may be prevented. item temperature period or speed 1 preheating 140 to 180 c 60 to 120 sec 2 temp. rise preheating temp to peak temp. 2 to 5 c /sec 3 heating 220 c min. 60 sec max. 4 peak 260 c max. 10 sec max. 5 gradual cooling peak temp. to 140 c 1 to 4 c /sec recommended profi le of refl ow soldering (ex) t : allowable temperature difference t < 150 c the rapid cooling (forced cooling) during gradual cooling part should be avoided, because this may cause defects such as the thermal cracks, etc. when the thermistors are immersed into a cleaning solvent, make sure that the surface temperatures of the devices do not exceed 100 c. performing re? ow soldering twice under the conditions shown in the ? gure above [recommended pro? le of re? ow soldering (ex)] will not cause any problems. however, pay attention to the possible warp and bending of the pc board. 4.2 hand soldering hand soldering typically causes significant temperature change, which may induce excessive thermal stresses inside the thermitors, resulting in the thermal cracks, etc. in order to prevent any defects, the following should be observed. the temperature of the soldering tips should be controlled with special care. the direct contact of soldering tips with the thermistors and/or terminal electrodes should be avoided. dismounted thermistors shall not be reused. (1) condition 1 (with preheating) (a) soldering: f 1.0 mm or below thread eutectic solder with soldering ? ux ? in the core. ? rosin-based and non-activated flux is recommended. (b) preheating: the thermistors shall be preheated so that the temperature gradient between the devices and the tip of soldering iron is 150 c or below. (c) temperature of iron tip: 300 c max. (the required amount of solder shall be melted in advance on the soldering tip.) (d) gradual cooling: after soldering, the thermistors shall be cooled gradually at room temperature. recommended profi le of hand soldering (ex) t : allowable temperature difference t < 150 c (2) condition 2 (without preheating) hand soldering can be performed without preheating, by following the conditions below: (a) soldering iron tip shall never directly touch the ceramic and terminal electrodes of the thermistors. (b) the lands are sufficiently preheated with a soldering iron tip before sliding the soldering iron tip to the terminal electrodes of the thermistors for soldering. conditions of hand soldering without preheating item condition temperature of iron tip 270 c max. wattage 20 w max. shape of iron tip f 3 mm max. soldering time with a soldering iron 3 sec max. 5. post soldering cleaning 5.1 cleaning solvent soldering ? ux residue may remain on the pc board if cleaned with an inappropriate solvent. this may deteriorate the electrical ch aracteristics and reliability of the thermistors. 5.2 cleaning conditions inappropriate cleaning conditions such as insufficient cleaning or excessive cleaning may impair the electrical characteristics and reliability of the thermistors. (1) insuf? cient cleaning can lead to: (a) the halogen substance found in the residue of the soldering ? ux may cause the metal of terminal electrodes to corrode. (b) the halogen substance found in the residue of the soldering flux on the surface of the thermistors may change resistance values. (c) water-soluble soldering flux may have more remarkable tendencies of (a) and (b) above compared to those of rosin soldering ? ux. sep. 2010 00 14
multilayer ntc thermistors supporting pin separated, crack check pin check pin bending torsion pc board splitting jig v-groove pc board outline of jig pc board chip component loading point v-groove loading direction pc board chip component loading point v-groove loading direction floor crack mounted pcb crack (2) excessive cleaning can lead to: (a) overuse of ultrasonic cleaning may deteriorate the strength of the terminal electrodes or cause cracking in the solder and /or ceramic bodies of the thermistors due to vibration of the pc boards. please follow these conditions for ultrasonic cleaning: ultrasonic wave output : 20 w/l max. ultrasonic wave frequency : 40 khz max. ultrasonic wave cleaning time : 5 min. max. 5.3 contamination of cleaning solvent cleaning with contaminated cleaning solvent may cause the same results as insuf? cient cleaning due to the high density of liberated halogen. 6.inspection process when mounted pc boards are inspected with measuring terminal pins, abnormal and excess mechanical stress shall not be applied to the pc board or mounted components, to prevent failure or damage to the devices. (1) mounted pc boards shall be supported by an adequate number of supporting pins with bend settings of 90 mm span 0.5 mm max. (2) con? rm that the measuring pins have the right tip shape, are equal in height and are set in the correct positions. the following figures are for your reference to avoid bending the pc board. item prohibited setting recommended setting bending of pc board 7. pr o t e c t i ve c o a t i n g when the surface of a pc board on which the capacitors have been mounted is coated with resin to protect against moisture and dust, it shall be confirmed that the protective coating which is corrosive or chemically active is not used, in order that the reliability of the thermistors in the actual equipment may not be in? uenced. coating materials that expand or shrink also may lead to damage to the thermistors during the curing process. 8. dividing/breaking of pc boards (1) abnormal and excessive mechanical stress such as bending or torsion shown below can cause cracking in the thermistors. (3) examples of pcb dividing/breaking jigs: the outline of pc board breaking jig is shown below. when pc boards are broken or divided, loading points should be close to the jig to minimize the extent of the bending also, planes with no parts mounted on should be used as plane of loading, which generates a compressive stress on the mounted plane, in order to prevent tensile stress induced by the bending, which may cause cracks of the thermistors or other parts mounted on the pc boards. (2) dividing/breaking of the pc boards shall be done carefully at moderate speed by using a jig or apparatus to prevent the thermistors on the boards from mechanical damage. prohibited dividing recommended dividing 9. mechanical impact (1) the thermistors shall be free from any excessive mechanical impact. the thermistor body is made of ceramics and may be damaged or cracked if dropped. never use a thermistor which has been dropped; their quality may be impaired and failure rate increased. (2) when handling pc boards with thermistors mounted on them, do not allow the thermistors to collide with another pc board. when mounted pc boards are handled or stored in a stacked state, impact between the corner of a pc board and the thermistor may cause damage or cracking and can deteriorate the withstand voltage and insulation resistance of the thermistor. other the various precautions described above are typical. for special mounting conditions, please contact us. sep. 2010 00 15

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